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Description. Henkel Loctite Ablestik 45LV Black, formerly Emerson and Cuming ECCOBOND, is a two component, room temperature or heat curing, epoxy adhesive that is used for general purpose applications on plastics, metal, and glass surfaces. It offers low viscosity, flexibility, and can be used with a broad range of catalysts. 1 gal Pail.

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Henkel AG Co KGaA Henkelstraße 79 1-340 Düsseldorf Germany Henkel Solutions for Leadframe Packaging Die Attach Films ELECTRICALLY NON-CONDUCTIVE DICING DIE ATTACH FILMS (DDF) PRODUCT DESCRIPTION KEY ATTRIBUTES DICING TAPE FILM THICKNESS (μm) WAFER THICKNESS (μm) MOISTURE SENSITIVITY LEVEL, MSL MODULUS AT 25°C (MPa) LOCTITE ABLESTIK ATB 100

Heraeus Contact Materials Kulicke & Soffa Bonding tråd. Humiseal 1B31, 1A33, 1B73,  Henkel Adhesive Electronics, a division of global materials innovator, Henkel Del#:1189741; tillverkare:Bergquist; Beskrivning:LOCTITE ABLESTIK 2332-17  1189-SNAPKIT2RubyconCAP KIT ALUM 85C 250-450V; 1189741Henkel/Loctite​LOCTITE ABLESTIK 2332-17; 118980-HMC612LP4 Image  1189-3693-KITRubyconCAP KIT ALUM 56UF-2200UF 27PCS; 1189741Henkel/​LoctiteLOCTITE ABLESTIK 2332-17; 118871-HMC621LP4 Image  23 juni 2015 — 01369. Beslutsdatum: 2010-11-30. Henkel Ireland Ltd.,. Ireland. ABLEFULL UF8826.

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This product is able to withstand the high reflow temperatures necessary for Pb-free solders @ 260°C. It is suitable for die sizes up to 12.7 x 12.7 mm. Information provided by Loctite® Vendors: Loctite Ablestik 2151 BiPax Tra-Bond is a two-part, strong, durable, thixotropic adhesive that improves great impact links at room temperature. It passes NASA outgassing standards and has an overall operating temperature of -70 to 115 °C. LOCTITE ABLESTIK 56C CAT 9 KIT May -2019 PRODUCT DESCRIPTION LOCTITE ABLESTIK 56C CAT 9 KIT provides the following product characteristics: Technology Epoxy Henkel’s liability will in no event exceed the amount of the concerned delivery. In case products are delivered by Henkel Colombiana, Henkel Ablestik Japan Ltd. at .

The combination of adhesive properties ensures reliable RF ground plane performance suitable for extreme environmental conditions. High adhesion strength at elevated temperatures LOCTITE ABLESTIK film products can be stored at -40°C for up to one year.

LOCTITE ABLESTIK 2100A die attach adhesive is designed for Pb-free array packaging. This product is able to withstand the high reflow temperatures necessary for Pb-free solders @ 260°C. It is suitable for die sizes up to 12.7 x 12.7 mm. Information provided by Loctite® Vendors:

Loctite Ablestik 2902 is a two component, thermally conductive, solvent-free, room temperature cure material formulated for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. The advance material has high adhesion and will bond to a variety of substrates. Some of the typical assembly applications include electrical modules Company profile page for Henkel Ablestik Japan Ltd including stock price, company news, press releases, executives, board members, and contact information Henkel is the world’s leading and most progressive provider of qualified materials for semiconductor packaging, printed circuit board (PCB) assembly and advanced soldering solutions. As the only materials developer and formulator with vast technical expertise for all materials required for package production and assembly, Henkel is LOCTITE ABLESTIK QMI536NB October-2014 PRODUCT DESCRIPTION LOCTITE ABLESTIK QMI536NB provides the following product characteristics: Henkel, is therefore, LOCTITE ABLESTIK CF 3366, Epoxy Film, Assembly LOCTITE® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications.

Henkel Loctite Ablestik E 3503-1 är optimerad för SMT-dispensering och tillverkning av enheter med hög volym. Den har hög vidhäftning till de underlag som 

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Please refer to the TDS for alternate cure schedules. Non-conductive. LOCTITE® ABLESTIK 77-2LTC adhesive is designed for attaching surface mounted devices to printed circuit boards prior to wave solder. Small, uniform dots may be dispensed for capacitor and resistor attach.

Henkel Ablestik 5025E performance is ideal for microwave and heat sink applications. In bonding microwave substrates into packages, it provides RF/EMI shielding.
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Once the material is fully cured and the solvent is evaporated, the adhesive has an LOCTITE ABLESTIK QMI538NB, BMI Hybrid, Die Attach, Non-conductive Paste. LOCTITE® ABLESTIK QMI538NB is a non-conductive die attach paste designed for applications which require very low stress and robust mechanical properties. Please refer to the TDS for alternate cure schedules. Non-conductive. LOCTITE® ABLESTIK 77-2LTC adhesive is designed for attaching surface mounted devices to printed circuit boards prior to wave solder.

Our unrivaled portfolio of adhesives, sealants and functional coatings are designed to transform markets and the way you work. We’re your global partner prepared to handle any challenge and develop a solution that is smart and sustainable A broad selection of electrically non-conductive and conductive LOCTITE ABLESTIK die attach paste formulations provide the reliability and performance today’s high-density laminate packages demand. Each package type – from BGAs to LGAs to SmartCards – has different requirements, which is why Henkel has developed a suite of Henkel Documents Henkel Adhesive Technologies is leading today’s markets and shaping tomorrow’s through its adhesives, sealants and functional coatings. We enable the transformation of entire industries, giving our customers a competitive advantage and offering consumers a unique experience.
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1189-SNAPKIT2RubyconCAP KIT ALUM 85C 250-450V; 1189741Henkel/Loctite​LOCTITE ABLESTIK 2332-17; 118980-HMC612LP4 Image 

LOCTITE ABLESTIK film products can be stored at -40°C for up to one year. The shelf life of the film is only valid when the material has Henkel is, therefore Henkel and Plastic Bank have opened their first three plastic waste collection centers in Cairo. The project is part of Henkel’s successful and long-term partnership with the social enterprise.


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LOCTITE ABLESTIK ABP 8068T series: 30 min. ramp to 200°C + 1 hour at 200°C SILVER IN RESIN MATRIX: 30 min. at 200°C I n-P a c k a g e a T h e r m a l u R e s i s t a n c e 1.75 (K / W) 2.00 1.50 1.25 1.00.75.50 0.504 LOCTITE® ABLESTIK ABP 8068T series 0.758 Silver in Resin Matrix Ag Cu PPF 1.594 Silver in Resin Matrix 0.505 LOCTITE ABLESTIK

LOCTITE ABLESTIK QMI529HT, BMI/Acrylate, Die attach LOCTITE® ABLESTIK QMI529HT die attach paste was developed as a soft-solder replacement or for high UPH performance applications. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater. LOCTITE® ABLESTIK 2600K adhesive is designed for thermal management applications requiring high heat extraction from the die. This adhesive uses a unique suspension system containing silver, thermoplastic and thermoset resin particles suspended in a solvent carrier.

LOCTITE® ABLESTIK 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for Electrically 

This adhesive can withstand continuous exposure at temperatures as high as 230ºC. It has also been tested to withstand short term exposures up to 280ºC. Please refer to the TDS for alternate cure schedules. LOCTITE® ABLESTIK 2600K adhesive is designed for thermal management applications requiring high heat extraction from the die. This adhesive uses a unique suspension system containing silver, thermoplastic and thermoset resin particles suspended in a solvent carrier. Once the material is fully cured and the solvent is evaporated, the adhesive has an LOCTITE ABLESTIK QMI538NB, BMI Hybrid, Die Attach, Non-conductive Paste.

This material is designed to minimize stress and resulting warpage between dissimilar surfaces. Information provided by Loctite® Vendors: LOCTITE ABLESTIK 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automated die attach equipment. The rheology of LOCTITE ABLESTIK 84-1LMISR4 adhesive allows minimum adhesive dispense and die put … LOCTITE ABLESTIK CF 3366, Epoxy Film, Assembly LOCTITE® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance suitable for extreme environmental conditions.